Amd Geode SC2200 Bedienungsanleitung Seite 425
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AMD Geode™ SC2200 Processor Data Book 445
Package Specifications
32580B
10.2 Physical Dimensions
The figures in this section provide the mechanical package outlines for the BGU481 (Thermally Enhanced Ball Grid Array)
package.
Figure 10-2. BGU481 Package - Top View
- AMD Geode™ SC2200 Processor 1
- Data Book 1
- Contents 3
- List of Figures 5
- List of Tables 10
- 1.0Overview 13
- 1.2 Features 14
- Overview 16
- 2.0Architecture Overview 17
- 2.2 Video Processor Module 22
- 2.3 Core Logic Module 23
- 2.4 SuperI/O Module 23
- 2.5.1 Reset Logic 24
- 3.0Signal Definitions 25
- Signal Definitions 26
- 3.1 Ball Assignments 27
- SC2200 Processor 28
- 3.2 Strap Options 43
- 3.4 Signal Descriptions 48
- 3.4.9 IDE Interface Signals 59
- 3.4.16 GPIO Interface Signals 66
- (Continued) 69
- Reserved - RSVD 78
- 4.3 WATCHDOG 79
- 4.3.2 WATCHDOG Registers 80
- 4.4 High-Resolution Timer 81
- 4.5 Clock Generators and PLLs 83
- Circuitry 84
- Default ADL Multiplier 85
- 0111 33.33 4 0100 133 85
- 4.5.4 SuperI/O Clocks 86
- 4.5.6 Video Processor Clocks 86
- 4.5.7 Clock Registers 87
- 5.0SuperI/O Module 89
- 5.1 Features 90
- 5.2 Module Architecture 91
- 5.3.4 Address Decoding 93
- Configuration 98
- SuperI/O Module 100
- 5.5 Real-Time Clock (RTC) 105
- 5.5.3 RTC Registers 111
- Table 5-19. RTC Register Map 111
- Table 5-20. RTC Registers 111
- Table 5-25. Extended RAM Map 115
- Table 5-24. Standard RAM Map 115
- 5.6.1 Event Detection 116
- Type Name 117
- Type Name 117
- 5.7 ACCESS.bus Interface 121
- 5.7.3 Acknowledge (ACK) Cycle 122
- 5.7.6 Arbitration on the Bus 123
- 5.7.7 Master Mode 123
- 5.7.8 Slave Mode 125
- 5.7.9 Configuration 125
- 5.8 Legacy Functional Blocks 129
- Offset Name 130
- 404h EDR Data Bits 130
- Architecture 131
- Table 5-43. Bank 1 Bit Map 134
- Table 5-44. Bank 2 Bit Map 134
- Table 5-45. Bank 3 Bit Map 134
- Port 3 (SP3) Functionality 135
- Table 5-56. Bank 1 Bit Map 139
- Table 5-57. Bank 2 Bit Map 139
- Table 5-58. Bank 3 Bit Map 139
- Table 5-59. Bank 4 Bit Map 139
- Table 5-60. Bank 5 Bit Map 140
- Table 5-61. Bank 6 Bit Map 140
- Table 5-62. Bank 7 Bit Map 140
- 6.0Core Logic Module 141
- 6.2 Module Architecture 142
- 6.2.2 PSERIAL Interface 143
- 6.2.3 IDE Controller 144
- Core Logic Module 146
- 6.2.4 Universal Serial Bus 147
- 6.2.5 Sub-ISA Bus Interface 147
- 6.2.6 AT Compatibility Logic 152
- Figure 6-7. PIT Timer 154
- 6.2.8 Keyboard Support 157
- C1 Power State - Active Idle 158
- Sleep States 160
- 6.2.11 GPIO Interface 167
- 6.2.12 Integrated Audio 167
- AMD Geode™ 170
- Processor 170
- SMI# (System Management 171
- Read to Clear 172
- Figure 6-15. Typical Setup 173
- Table 6-12. Cycle Types 174
- 6.3 Register Descriptions 175
- 6.3.2 Register Summary 176
- 6.4 Chipset Register Space 190
- CPI mode 202
- . Reads as 0 220
- 20h and 24h) 221
- 1), this bit allows signal 230
- Not Used Reset Value: 00h 244
- . Must be set to 0 252
- 0 Reserved. (Read Only) 260
- Not Used 269
- : X-Bus Expansion Registers 278
- 00h/02h[14] 278
- Reserved Reset Value = xxh 291
- 7.0Video Processor Module 307
- 7.1 Module Architecture 308
- 7.2 Functional Description 309
- (Not normally User Data) 310
- Figure 7-4. VIP Block Diagram 311
- Video Processor Module 312
- 7.2.2 Video Block 315
- 7.2.3 Mixer/Blender Block 318
- Windows Configuration 321
- 7.2.5 Integrated DACs 323
- 7.2.6 TFT Interface 324
- crystal oscilla 325
- 7.3 Register Descriptions 326
- 8.0Debugging and Monitoring 349
- Debugging and Monitoring 350
- 9.0Electrical Specifications 351
- 9.1.4 Operating Conditions 352
- 9.1.5 DC Current 353
- Electrical Specifications 354
- 9.2 DC Characteristics 358
- 9.3 AC Characteristics 363
- GX1 Processor Series Data 365
- 9.3.2 Video Port 367
- 9.3.3 CRT and TFT Interface 368
- 9.3.4 ACCESS.bus Interface 370
- Note 2. t 371
- Ω1 KΩ 10 pF 373
- Figure 9-18. PCI Reset Timing 378
- 9.3.6 Sub-ISA Interface 379
- 9.3.7 LPC Interface 383
- 9.3.8 IDE Interface 384
- 9.3.11 Fast IR Port 407
- 9.3.13 Audio Interface (AC97) 412
- 9.3.14 Power Management 417
- 9.3.15 Power-Up Sequencing 418
- 9.3.16 JTAG Interface 420
- 10.0Package Specifications 423
- Figure 10-1. Heatsink Example 424
- 10.2 Physical Dimensions 425
- Package Specifications 426
- A.1 Order Information 427
- Table A-1. Revision History 428
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