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ABSTRACT
The thermal analysis of any electronic component is often limited by the inability to
obtain detailed and accurate temperature data. To validate any thermal model developed
to describe the behavior of microprocessors, two methods are currently used. One technique
simulates the thermal response of each component given a certain input, the other uses
thermocouples as a method of data collection in specific chip areas. Both methods have
various shortcomings: simulation relies on imperfect models, while data collection cannot
provide fine-grained temperature values.
To solve this problem, we investigated the establishment of a new methodology to validate
a thermal simulation model. It involves the use of infrared thermography to capture the
distribution of temperature and the power dissipation of a chip in real time.
The installation of such a measurement system requires the replacement of the cooling
system installed on the processor by another system which enables the passage of IR radiation
to be detected by the camera. Two solutions were proposed, the use of mineral oil and a
thermoelectric cooler (a Peltier module). The best results were obtained with the latter,
allowing better control and temperature stabilization. The data collected by our system
were then used to validate the accuracy of the thermal of two thermal models, Comsol and
ICTherm.
Results show that both ICTherm and Comsol provide temperature values that are within
the accuracy of the infrared camera used in this study, i.e. ±2
◦
C.
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