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Chapter 5 Thermal Design 17

23802E—September 2000 AMD Duron™ Processor Data Sheet

Preliminary Information

5 Thermal Design

For information about thermal design, including layout and

airflow considerations, see the AMD Thermal, Mechanical, and

Chassis Cooling Design Guide, order# 23794 and the cooling

guidelines on www.amd.com. Table 2 shows the thermal design

power. The thermal design power represents the maximum

sustained power dissipated while executing publicly-available

software or instruction sequences under normal system

operation at nominal VCC_CORE. Thermal solutions must

monitor the processor temperature to prevent the processor

from exceeding its maximum die temperature. The maximum

die temperature is specified through characterization at 90°C.

Table 2. Thermal Design Power

Frequency

(MHz)

Voltage

Maximum Thermal

Power

Typical Thermal

Power

600

1.6 V

26.07 W 23.40 W

650

27.87 W 25.02 W

700

29.66 W 26.63 W

750

31.46 W 28.25 W

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AMD Duron Bedienungsanleitung Seite 29